| 1. | Specification for flexible multilayer printed boards with through conections
有贯穿连接的挠性多层印制板规范 |
| 2. | Flexible multilayer printed board
扰性印制板 |
| 3. | Printed boards ; part 9 : specification for flexible multilayer printed boards with through connections
印制电路板.第9部分:有贯穿连接的挠性多层印制板规范 |
| 4. | Sectional specification - flexible multilayer printed boards with through connection ; german version en 123800 : 1996
分规范.带贯通连接的挠性多层印制电路板 |
| 5. | System of quality assessment - sectional specification - flexible multilayer printed boards with through - connections
质量评估体系.分规范.直通连接的挠性多层印制板 |
| 6. | System of quality assessment - capability detail specification - flexible multilayer printed boards with through - connections
质量评估体系.性能详细规范.贯穿连接的挠性多层印制板 |
| 7. | Printed boards ; part 9 : specification for flexible multilayer printed boards with through connections ; identical with iec 60326 - 9 : 1991
印制电路板.第9部分:带贯穿连接的柔性多层印制电路板 |
| 8. | Harmonized system of quality assessment for electronic components - sectional specification - flexible multilayer printed boards with through connections
电子元件质量评定协调系统.分规范.柔性多层连接印制电路板 |
| 9. | Harmonized system of quality assessment for electronic components - capability detail specification : flexible multilayer printed boards with through connections
电子元器件用质量评估协调体系.性能详细规范:整体连接挠性多层印刷电路板 |
